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IP PROTECT EXPO LAUNCHES EXHIBITOR AND SPEAKER OPPORTUNITIES FOR 2013

IP Events Limited, the organisers of IP Protect Expo, co-hosted by ACG (Anti- Counterfeiting Group), announces the release of floor plans and a call for papers for IP Protect Expo 2013.

Following on from the huge success of the inaugural IP Protect Expo 2012, which brought together brands, legal firms and specialist providers from the IP protection industry; plans for the 2013 Expo are even bigger and better! With extensive marketing plans already in place, the intention is to attract a greater international presence, which will increase cross-functional and industry networking opportunities whilst also providing a focus on a more holistic approach to intellectual property protection.

IP Protect Expo 2013 will feature an extensive exhibition floor with over 60 exhibitors including brands, law enforcement, associations and providers of products and services in the brand protection field. This will be supported by a world class seminar programme featuring hands-on examples and case studies by famous brands and will cover all aspects of IP protection including the use of on-line and offline services and technologies.

A detailed floor plan of the exhibition space and the exhibition brochure can be viewed on www.ip-protextexpo.com/exhibitors. Speakers who wish to submit a synopsis of their proposed paper can do so by contacting info@ip-protectexpo.com but please note that any product or service provider may only present as part of a case study submitted by an IP rights holder.

IP Protect Expo is the first event of its kind that has been developed in full partnership with suppliers and brand owners, offering new and exciting networking opportunities for the global IP protection community to enhance learning, strengthen understanding, develop best practice and create bilateral relationships across every part of the industry.

IP Protect Expo 2013 will once again be held in the prestigious Business Design Centre in London from 5th-6th February 2013.


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